Main product technical features and indicators:

Using patented technology -109 misaligned fly eye lenses with building blocks - to eliminate diffraction and enhance steep lines,
Improve practical photolithography resolution.
● Adopting i-line (365nm) ultraviolet exposure light source and advanced optical system to achieve high uniform illumination, light
The source has a small focal angle and good parallelism.
Equipped with a binocular dual field microscope and CCD image alignment system, featuring a 22 inch widescreen LCD display
The device can simultaneously observe the real-time alignment process and store and record exposure results.
Adopting a three-point ball air floating leveling mechanism for automatic sample leveling, it has high leveling capability for large and small samples
Accuracy.
Exposure parameter settings are computer-controlled, with intelligent process operation and a user-friendly menu interface.
The key components are imported international brand products with high overall reliability.
● Supports four types of exposure: vacuum contact exposure, hard contact exposure, pressure contact exposure, and proximity exposure
Function.
Exposure area: 150mm × 150mm; Alignment accuracy: ≤ ± 0.8 μ m.
Mask size: 3 inches, 4 inches, 5 inches, 7 inches.
Lithography resolution: 0.8-1 μ m (positive photoresist with a thickness of 2 μ m).
Exposure mode: timed (countdown mode), can be set arbitrarily from 0.1s to 9999s, with a setting accuracy of 0.1s.
Maximum adhesive thickness: 500 μ m (SU8 adhesive, user provided uniform adhesive conditions).
Mercury lamp power: 1000W (DC, German Osram, long-life type).
Uneven lighting: 2.5% (within the range of 100mm), 5% (within the range of 150mm).